热导率测量系统
扫描型热探针微图像
STPM-1000
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本装置能够同时测量泽贝克系数和导热系数的面内二维分布。能在20μm节距进行材料图谱分析。
特点
- 可以在20μm间距进行分布分析评估
- 使用标准物质进行校准可以提高导热系数的准确度
用途
- 热电材料的简单性能评估
- 功能分级的材料的热特性分布评估
- 无机材料，高分子材料和结晶材料的均匀性评估
- 实际使用材料（印刷电路板，多层板等）的缺陷评估
规格
| Type | STPM-1000 |
|---|---|
| Measurement temperature | RT + 5℃ |
| Maximum sample size | Square 20 mm × Thickness 5 mm |
| Accuracy of Seebeck coefficient | ±10% (by single bulk sample with thickness 1mm) |
| Accuracy of thermal conductivity* | ±50% (by single bulk sample with thickness 1mm) |
| Measurement time at one point | less than 10 s. |
| Local resolution | 20μm |
| Resolution of position control | 1μm |
| Sample moving distance | x-axis 50 mm, y-axis 50 mm, z-axis 10 mm |
*Thermal conductivity of unknown sample can be estimated by reference sample of known thermal conductivity and comparison calibration.
Measurement principle
Seebeck coefficient
Calculate from voltage difference (ΔV) and temperature difference (ΔV) beteween temperature at contact point Tcp and T3.
(Tcp is calculated from T1 and T2.)
Thermal conductivity
Calculate from T1 - T2.
Measurement examples
Seebeck coefficient and thermal conductivity distribution and composition dependence of Seebeck coefficient and thermal conductivity of (Bi1-xSbx)2Te3(0.5<x<1)
Seebeck coefficient distribution
Thermal conductivity distribution
Composition dependence of Seebeck coefficient
Composition dependence of thermal conductivity
Applications
- Simple performance evaluation of thermoelectric materials
- Thermal property distribution evaluation of functionally graded materials
- Homogeneity evaluation of inorganic materials, polymer materials and crystalline materials
- Defect assessment of practical materials (Print substrate, multilayer substrate etc.)
Utility
| Power supply | AC 100V 15A (excluding PC) |
|---|---|
| External dimensions | W510 × D650 × t460 (mm) |
| Weight | Approx. 70kg |
| Space requirement | Approx. W1200 × D900 (mm) for table |
