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热物性测定装置
稳态法热导率测量系统
GH系列
アルバック販売
评估高分子、玻璃等的热传导性。是根据美国标准ASTM E1530开发的热流计方式定常法热传导率测定装置。
在50～280℃的温度范围，进行低热传导材料的测量。
在50～280℃的温度范围，进行低热传导材料的测量。
特点
- 可最大限度地减少保护加热器在表面方向上的热损失
- 操作简便，安全可靠
专利和标准
美国标准ASTM E1530
用途
- 半导体封装材料的导热系数评估
- 玻璃基板的导热性评估
- 高分子材料的导热性评估
- 陶瓷材料的导热性评估
- 低导热金属的导热性评估
- 热电材料的导热性评估
规格
| Temperature range | 50 ～ 280℃ |
|---|---|
| Sample size | ① □ 25 × t 1.5 ～ 8 (mm) ② Φ 25 × t 1.5 ～ 8 (mm) ③ □ 50 × t 1.5 ～ 12 (mm) ④ Φ 50 × t 1.5 ～ 12 (mm) |
| Measurement range | Sample size①② 0.1～15Wm-1K-1 Sample size③④ 0.1～20Wm-1K-1 |
| Atmosphere | Air |
Measurement principle diagram
Calculation formula of thermal resistance
Rs：Thermal resistance of sample
N ：Proportional coefficient
TL：Lower side temperature of sample
Tu：Upper side temperature of sample
Q ：Heat flux meter output
Ro：Contact thermal resistance of upper and lower interface
By using N calculated from calibration sample, thermal resistance of sample, Rs, is found by the above equation. Thermal conductivity, λ, is given by N substituting Rs into the following equation.
λ：Thermal conductivity of sample
d：Sample thickness
Screen for setting and measurement
＊The software is actually Englush version.
Screen for inputting sample conditions.
Screen for measurement.
Screen for displaying date grafh.
