Thermal Conductivity Measurement System

Thermal conductivity measurements covering a wide range of materials not only thermoelectric materials but also metals, ceramics, carbon etc.
The systems measure 3 thermal constants (Thermal diffusivity, Specific heat capacity, Thermal conductivity) for uniform solid materials such as thermoelectric materials, ceramics, carbon, Metal, etc.

2 dimensional distribution of Seebeck coefficient and thermal conductivity measurement system by thermal probe.
STPM-1000 is used for evaluating Seebeck coefficient and thermal conductivity simultaneously. Simple evaluation of thermoelectric materials is possible by simultaneous evaluations of seebeck coefficient and thermal conductivity. The thermal conductivity distribution evaluation of functionally graded materials, multilayer substrates and organic materials is also possible. STPM-1000 is expected to use materials evaluation as a basic tool.

Capable of evaluation of heat radiation film in the thickness direction and anisotropy.
The most suitable system for the evaluations of heat dissipation films etc. By using Xenon lamp, it enables to minimize the damage to the sample. Sample anisotropy can also easily measure by using the original attachment as an option.

Thermal conductivity evaluation for a nano thin film at normal direction.
TCN-2ω is the world's only system which can measure thermal conductivity for a nano thin film at normal direction.

Thermal conductivity evaluation in-plane direction of films, thin sheets and thin films etc.
This system can measure thermal diffusivity of sheet materials in-plane direction by scanning laser heating AC method (Angstrom method).
About high thermal conducting films, sub-micron thin films can also be measurable.