Sputtering System
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Sputtering is a type of physical vapor deposition (PVD) technology that involves ejecting atoms from a target material to form a thin film on a substrate.
The sputtering process begins by introducing an inert gas, such as argon, into a vacuum chamber and applying voltage to generate plasma. In this plasma, argon ions collide with the target material, causing atoms to be ejected in a process known as "sputtering." These ejected atoms then travel to the substrate, where they form a uniform and high-quality thin film.
ULVAC's small-scale experimental sputtering systems offer high-precision thin film deposition technology, ideal for research and development as well as small-scale production. Their compact design allows for efficient use even in limited spaces.
Sputtering System
Sputtering System
VTR-151M/SRF
Small-sized high-frequency sputtering device with an RF power supply.
Ideal for basic research and development experiments because of the deposition capabilities for metals, semiconductors and insulators.
Sputtering System
RFS-201
Small-sized high-frequency sputtering device with an RF power supply.
Ideal for basic research and development experiments because of the deposition capabilities for metals, semiconductors and insulators.