Pulsed and DC power supply systems
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ULVAC’s pulse and DC power supply systems offer a comprehensive product lineup to support various sputtering processes:
・DC Power Supply (Direct Current): "Model:DC"/ "Model:Digital DC"
・DC Pulse Power Supply: "Model:DC PULSE"
・LF Power Supply: "Model:SG"
・External Accessories: "Model:A2K" / "Model:MFU"
These products are equipped with features to address challenges in the sputtering process and can be utilized across a wide range of fields and applications, from research and development to production lines.
Pulse and DC power supply systems are primarily used as power sources in PVD (sputtering) processes. Sputtering enables the formation of various films, including metal films, alloy films, oxide films, nitride films, and transparent conductive films. These films are created by adjusting sputtering conditions such as target material, gas composition, pressure, and power. Due to this versatility, sputtering technology is utilized across a wide range of applications. In general, DC power supplies are used for sputtering metal films, while DC pulse power supplies and LF power supplies are suitable for forming oxide or nitride films through reactive sputtering. Additionally, the optimal power supply can be selected according to the specific requirements of the process. ULVAC’s pulse and DC power supply systems leverage extensive expertise gained from various applications to support high-quality film formation processes. We encourage you to take full advantage of these systems.
DC power supply_Model:DC
DC Power Supply with High Reliability and Advanced Arc Handling Function
DC power supply_Model:DC
Model: DC
The "Model:DC" is a direct current power supply (DC power supply) for sputtering. It is composed of reliable components and circuits. It is a highly reliable power supply that is ideal for plasma loads by reflecting the know-how we have cultivated over many years, including the application of power supplies, in the design.
DC power supply_Model：Digital DC
High-Performance DC Power Supply Continually Evolving with New Features for Process Optimization
DC power supply_Model：Digital DC
Model: Digital DC
The Digital "Model:DC" is a DC power supply for sputtering. It is composed of reliable components and circuits. It is a highly reliable power supply that is ideal for plasma loads by reflecting the know-how we have cultivated over many years, including the application of power supplies, in the design.
DC PULSE power supply_Model:DC PULSE
DC Pulse Power Supply Enabling Stable Reactive Sputtering
DC PULSE power supply_Model:DC PULSE
Model: DC PULSE
The "Model:DC PULSE" is a pulsed power supply that is effective in suppressing abnormal discharges that occur in reactive processes.
This power supply reverses the output voltage at a set period and cancels out charge accumulation (charge-up) on the target surface, thereby suppressing abnormal discharge and improving yield and throughput.
LF power supply_SG
LF Power Supply Supporting Dual Cathodes with Both Reliability and Stability
LF power supply_SG
Model: SG
It is designed for plasma generation such as LF power supply, dual cathode sputtering, plasma CVD, etc., and can continuously output rated power at frequencies from 20kHz to 100kHz for plasma loads. Highly reliable and ideal for plasma loads that reflect know-how including power supply applications cultivated over many years in the design
Power supply.
PULSE unit _Model:A2K
Retrofit Pulse Unit to Achieve a Better Deposition Process
PULSE unit _Model:A2K
Model: A2K
The "Model:A2K", which is available as an external unit for DC power supplies, is an abnormal discharge prevention unit that converts a DC output into a pulse output and neutralizes the charge on the target.
Bipolar unit _MFU
Retrofit Bipolar Unit to Achieve a Better Deposition Process
Bipolar unit _MFU
Model: MFU
The MFU, which is available as an external unit for DC power supplies, is an MF power supply for use in sputtering of dual cathodes. It is effective not only for metal films but also for reactive deposition. Stable sputtering is achieved without the loss of the anode.